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eight-channel constant current sink with current match AP3608E data sheet 1 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited general description the AP3608E is an eight-channel constant current sink with current match used fo r led driver. it uses an external resistor to set the current for eight led strings with an accuracy of 1.5%. the full scale led current can be adjusted from 10ma to 100ma fo r each chan- nel. the led light can be adjusted by pwm dimming function. the device can keep workin g when led opens with- out damage. it features under voltage lockout protec- tion and over temperature protection. the AP3608E has f our interface terminals (fb, sdb, fbx and sdbx pins). the first two terminals allow the device to work with a dc/dc converter to drive led arrays for good performance. and the other two enable the device to be connected in parallel. the AP3608E is av ailable in qfn-4 4-24, tssop- 20(edp) and soic-20 packages. features input voltage range: 4.2v to 5.5v typical output current: 480ma (60ma/1v per channel) maximum output current: 800ma (100ma/1.5v per channel) current match accuracy: 1.5% pwm dimming control open led self-check and protection under voltage lockout protection over temperature protection fbx and sdbx pins enable parallel application applications notebook lcd display modules lcd monitor lcd tv figure 1. package types of AP3608E qfn-4 4-24 tssop-20(edp) soic-20
eight-channel constant current sink with current match AP3608E data sheet 2 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited figure 2. pin configuration of AP3608E (top view) pin configuration (qfn-4 4-24) fn package pin 1 dot by marking 1 2 3 4 5 6 78 9101112 13 14 15 16 17 18 19 20 21 22 24 23 ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 nc nc nc pwm nc iset fb sdb agnd nc vcc en nc sdbx fbx pgnd exposed pad (tssop-20(edp)/soic-20) g/m package 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 ch1 ch2 ch3 ch4 pgnd pgnd ch5 ch6 ch7 ch8 en vcc agnd sdbx sdb fb iset fbx nc pwm note: agnd must be quiet and directly connected to total c in
eight-channel constant current sink with current match AP3608E data sheet 3 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited pin number pin name function qfn-4 4-24 tssop-20(edp)/ soic-20 1, 24, 23, 22, 20, 19, 18, 17 1, 2, 3, 4, 7, 8, 9, 10 ch1to ch 8 white led cathode conne ction pin. these pins should be connected to gnd if not used 2 ,3 ,4, 6, 7, 13 12 nc no connection 511pwm pwm dimming control pin. adding a pw m signal to this pin to control led dimming (see figure 10 for detail dimming control mode). if not used, connect it to the high level 813fbx this pin is an interface terminal. c onnecting it with fb pin can achieve parallel application. if not used, leave it unconnected 914iset led current set pin. an external resistor is connected to this pin to set each channel current according to i channel =1.194*400/r iset 10 15 fb feedback pin. this pin is an inte rface terminal, which samples the volt- age of each channel, and outputs the lowest voltage of the string to dc/ dc converter 11 16 sdb this pin is an interface terminal. sdb pin outputs low logic to dc/dc converter under the condi tions such as AP3608E receives shutdown sig- nal from en pin or all channels are inactive. when AP3608E is on pwm dimming mode, the signal in sd b pin is synchoronous with pwm signal 12 17 sdbx this pin is an interface terminal. connecting it with sdb pin can achieve parallel application. if not used, connect it to gnd 14 18 agnd ground pin. it would be useful when connected with pgnd and exposed pad 15 19 vcc input voltage pin 16 20 en enable pin. logic high enables the ic and logic low disables the ic 21 5, 6 pgnd ground pin. it would be useful when connected with agnd and exposed pad ep exposed pad. it would be useful when connected with agnd and pgnd pin description
eight-channel constant current sink with current match AP3608E data sheet 4 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited functional block diagram figure 3. functional block diagram of AP3608E a (b) a for qfn-4 4-24 b for tssop-20 (edp)/soic-20 pwm dimming sdb dff bandgap uvlo en otp en logic time out 3v 100mv ch1 fb ch2 disable or all stg or synchronous with pwm signal 8 100:1 iset current sink en current sink current sink ch3 current sink ch4 current sink ch5 current sink ch6 current sink ch7 current sink ch8 ch2 min.(ch1...ch8, fbx) ch3 ch4 ch5 ch6 ch7 ch8 v cc max.(ch1...ch8) stg (short to gnd) comp en 100mv test ch1...ch8 8 ch1...ch8 v ref en 8 ch1 vcc gnd pwm 1 6 v ref v cc + opa 4 sdbx fbx 1 (1) 5 (11) 8 (13) 9 (14) 10 (15) 11 (16) 12 (17) 14 , 21 (5, 6, 18) 15 (19) 16 (20) 17 (10) 18 (9) 19 (8) 20 (7) 22 (4) 23 (3) 24 (2)
eight-channel constant current sink with current match AP3608E 5 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited data sheet ordering information package temperature range part number marking id packing type qfn-4 4-24 -40 to 85 o c AP3608Efntr-g1 b3b tape & reel tssop-20(edp) AP3608Egtr-g1 AP3608Eg-g1 tape & reel soic-20 AP3608Em-g1 AP3608Em-g1 tube AP3608Emtr-g1 AP3608Em-g1 tape & reel circuit type package fn: qfn-4 4-24 g1: green AP3608E - tr: tape and reel bcd semiconductor's pb-free products , as designated with "g1" suffix in the part number, are rohs compliant and green. parameter symbol value unit input voltage v cc -0.3 to 6 v iset pin voltage v iset -0.3 to 6 v en pin voltage v en -0.3 to 6 v feedback pin voltage v fb -0.3 to 6 v sdb pin voltage v sdb -0.3 to 6 v pwm pin voltage v pwm -0.3 to 6 v voltage per channel (note 3) v chx -0.3 to 40 v thermal resistance (junction to ambient, no heat sink) ja qfn-4 4-24 60 o c/w tssop-20(edp) 35 (note 2) soic-20 87 operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (machine model) 200 v esd (human body model) 6000 v note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other condi tions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolut e maximum ratings" for extended periods may affect device reliability. note 2: the chip is soldered to 60mm 2 (4mm 15mm) copper (top side solder mask) of 1oz. on pcb with 8 0.5mm vias. note 3: breakdown voltage. absolute maximum ratings (note 1) g: tssop-20(edp) blank: tube m: soic-20
eight-channel constant current sink with current match AP3608E data sheet 6 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited parameter symbol min max unit input voltage v cc 4.2 5.5 v recommended pwm dimming frequency f pwm 0.1 25 khz full scale setting current per channel v chx 0.5v i chx 10 25 ma v chx 1v 10 65 v chx 1.5v 10 110 operating temperature range t a -40 85 o c recommended operating conditions electrical characteristics parameter symbol conditions min typ max unit input section input voltage v in 4.2 5.5 v quiescent current i q no load 0.5 1 ma shutdown quiescent current i sdb v en =0v 0.1 1 a under voltage lockout threshold v uvlo falling edge 3.6 3.8 4.0 v under voltage lockout hysteresis v huvlo 200 mv current sink section iset reference voltage v iset 1.170 1.194 1.218 v current multiplication ratio k i chx /i set 370 400 430 maximum output current per channel i chx_max v chx = 0.5v 23 45 ma v chx = 1v 65 70 v chx = 1.5v 110 120 current matching between any two channels i ch-match i chx = 60ma v chx = 1v -1.5 1.5 % current sink saturation voltage per channel v chx_sat i chx =20ma 0.45 v i chx =60ma 0.8 i chx =100ma 1.2 output current line regulation v cc = 4.2v to 5.5v 2 %/v output current load regulation v chx =0.5v to 2.8v 4 % limits in standard type face are guaranteed for v in =v en =5v, r iset =8k ? ,, t a =25 o c, unless otherwise specified.
eight-channel constant current sink with current match AP3608E 7 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited data sheet 0 20406080100 0 2 4 6 8 10 12 14 16 18 20 current per channel (ma) duty cycle (%) -60 -40 -20 0 20 40 60 80 100 120 140 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 current per channel (ma) temperature ( o c) r iset =23k parameter symbol conditions min typ max unit enable section en pin high level threshold voltage v ih_en 1.8 v en pin low level threshold voltage v il_en 0.8 v pwm dimming section pwm high level threshold voltage v ih_pwm 1.8 v pwm low level threshold voltage v il_pwm 0.8 v interface section sdb high level output voltage v oh 2.4 v sdb low level output voltage v ol 0.4 v feedback output current i fb 515 a total device self-check voltage @ open led v check 3.0 v thermal shutdown temperature t otsd 160 o c thermal shutdown hysteresis t hys 20 o c electrical characteristics (continued) limits in standard type face are guaranteed for v in =v en =5v, r iset =8k ? ,, t a =25 o c, unless otherw ise specified. typical performance characteristics v in =v en =5v, r iset =8k ? ,, t a =25 o c, unless otherwise specified. figure 4. current per c hannel vs. temperature figure 5. current per channel vs. duty cycle
eight-channel constant current sink with current match AP3608E data sheet 8 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 59.0 59.5 60.0 60.5 61.0 current per channel (ma) input voltage (v) 0.51.01.52.02.53.03.5 59.0 59.5 60.0 60.5 61.0 current per channel (ma) voltage per channel (v) figure 6. current per channel vs. input voltage figure 7. current per channel vs. voltage per channel typical performance ch aracteristics (continued) v in =v en =5v, r iset =8k ? ,, t a =25 o c, unless otherwise specified. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 120 140 maximum output current (ma) voltage per channel (v) figure 8. maximum output current vs. voltage per channel figure 9. feedback voltage vs. feedback current 0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.0 0.1 0.2 0.3 0.4 0.5 feedback voltage (v) feedback current (ma)
eight-channel constant current sink with current match AP3608E 9 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited data sheet function description the AP3608E is designed for led display application which contains eight well -matched current sinks to provide constant current through led. the full scale led current can be adjusted from 10ma to 100ma per channel with an external resistor. if there is some channel unused, the channel pin should be connected to ground. the led bright dimming can be achieved through pwm dimming. the AP3608E can work with a dc/dc converter to drive led arrays for good performance. the device can keep working when led opens without damage, and it features under voltage lockout protection and over temperature protection. the detailed information will be discussed in open led self-check and protection section. 1. led current setting the maximum led current can be set up to 100ma per channel by iset pin. when the led current is greater than 100ma, two or more channels can be par- alleled to achieve larger drive current. to set the reference current i set , connect a resistor r iset between this pin and ground. the value of r iset can be calculated by the following formula: this reference current is multiplied internally with a gain (k) of 400, and then mirrored on all enabled channels. this sets the maximum led current, referred to as 100% current (i chx_max ). the value can be calculated by the following formula: the led current can be re duced from 100% by pwm dimming control. 2. pwm dimming mode the led current can be ad justed by applying the pwm signal to pwm pin. on this mode, all enabled channels are adjusted at the same time and the brightness can be adjusted from 1%*i chx_max to 100%*i chx_max (@f dimming =2khz). during the "high level" time of the pwm signal, the led turns on and the 100% current flows through led. during the "low level" time of the pwm signal, the led turns off and almost no current flows through led. so the average current through led is changed and the brightness is adjusted. the external pwm signal frequency applied to pwm pin can be allowed to 100hz or higher. an example for pwm dimming is shown in figure 10. all 8 channels are set to the maximum current i chx_max at the beginning. when a 50% duty cycle pwm signal is applied to pwm pin, average current valued 50%* i chx_max flows through the 8 channels. when an 80% duty cycle pwm signal is applied to pwm pin, average current valued 80%*i chx_max flows through the 8 channels. iset set r v 194 1 i / . = set max ch i k i ? = x_ figure 10. pwm dimming example of AP3608E pwm 50% duty cycle ch1...ch8 current 8 0% duty cycle 0 0 i ch_max i ch_max i ch_max
eight-channel constant current sink with current match AP3608E data sheet 10 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited function description (continued) 3. open led self-check and protection the AP3608E can work w ith a dc/dc converter to achieve good performance, such as self-check and protection against open led. the sdb pin and fb pin are the interface terminals for working with the dc/ dc converter. fb pin samples voltage of each channel, and outputs the lowest voltage of all strings to dc/dc converter. when AP3608E gets shutdown signal from en pin or all channels are inactive, sdb pin outputs low logic to dc/dc converter. when AP3608E is on pwm dimming mode, the sdb pin outputs the signal which is synchronous with pwm signal to dc/dc converter. figure 11 is the typical cir- cuit of AP3608E applied with a boost converter ap3039. if any enabled led string opens, voltage on the corresponding chx pin goes to zero and the fb pin outputs the zero voltage to boost converter. so the boost converter operates in open loop and the voltage on remaining chx pin goes higher. once the voltage on remaining chx pin reaches the self-check voltage 3v, the AP3608E begins looking up the open string. after finding the open channel, AP3608E removes the corresponding chx pin from boost control loop, then the boost circuit is controlled in the normal manner. once the circuit returns nor mal operation, the voltage on the chx pin is regulated to the normal level. it is necessary to pay attention that the open strings are removed from boost regulation, but not disabled. if the open led string is reconnected, it will sink current up to the programmed current level. 4. parallel operation mode the AP3608E can be paralleled to drive more strings of led. connecting an AP3608E sdb pin and fb pin with another AP3608E sdbx pin and fbx pin can achieve parallel application. more details please refer to figure 11.
eight-channel constant current sink with current match AP3608E 11 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited data sheet typical application single chip application figure 11. typical applications of AP3608E multi chips application out cs ov vin uvlo rt ss comp shdn en sdb fb fb vcc gnd fbx gnd ch2 ch1 a p 3 0 3 9 iset 1# AP3608E c in1 10 f c in2 r c 10k c c 10 nf r t 10 k off on v in :6v to27v c ss 0 . 1 f r cs 30 m c out 10 f ch8 sdbx AP3608E vcc 5.0v external c v vcc pwm en v cc off on pwm dimming r3 r4 10* 8 r1 r2 0.1 f sdb fb vcc fbx gnd ch2 ch 1 iset n# AP3608E ch8 sdbx pwm en 10* 8 8k 8k 10* 8 sdb fb vcc fbx gnd ch2 ch1 iset ap 3608e ch8 sdbx pwm en pwm dimming c in2 0.1 f AP3608E vcc 5.0v external off on c led v led single channel paralleled channels 10 * 4 sdb fb vcc fbx gnd ch2 ch1 iset AP3608E sdbx pwm en pwm dimming c in2 0.1 f AP3608E vcc 5.0v external off on c led v led ch4 ch3
eight-channel constant current sink with current match AP3608E data sheet 12 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited mechanical dimensions qfn-4x4-24 unit: mm(inch) 3.900(0.154) 4.100(0.161) 3.900(0.154) 4.100(0.161) 0.200(0.008) min 0.500(0.020) bsc 0.300(0.012) 0.500(0.020) 0.180(0.007) 0.300(0.012) 2.600(0.102) 2.800(0.110) 0.700(0.028) 0.800(0.031) 0.000(0.000) 0.050(0.002) 0.153(0.006) 0.253(0.010) n1 n7 n13 n19 n24 2.600(0.102) 2.800(0.110) pin 1 dot by marking
eight-channel constant current sink with current match AP3608E 13 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited data sheet mechanical dimens ions (continued) tssop-20(edp) unit: mm(inch) 0.650(0.026)typ 6.200(0.244) 6.600(0.260) #1 pin 6.400(0.252) 6.600(0.260) index 0.750(0.030) 0.850(0.033) dp 0.000(0.000) 0.100(0.004) 2.900(0.114) 3.100(0.122) 4.100(0.161) 4.300(0.169) 0.200(0.008) 0.280(0.011) 0.050(0.002) 0.150(0.006) 0.900(0.035) 1.050(0.041) 1.200(0.047) max 0.340(0.013) 0.540(0.021) 10 14 0.250(0.010)typ 0.450(0.018) 0.750(0.030) 1.000(0.039) ref 0 8 r0.090(0.004)min r0.090(0.004)min top & bottom 4- 0.200(0.008)min 4.300(0.169) 4.500(0.177) 0.100(0.004) 0.190(0.007) exposed pad note: eject hole, oriented hole and mold mark is optional.
eight-channel constant current sink with current match AP3608E data sheet 14 mar. 2011 rev. 1. 5 bcd semiconductor manufacturing limited mechanical dimens ions (continued) soic-20 unit: mm(inch) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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